CVE-2019-14037 - Qualcomm Sda660 Firmware, Qualcomm Qcn7606 Firmware and Qualcomm Mdm9607 Firmware
Close and bind operations done on a socket can lead to a Use-After-Free condition. in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables in APQ8009, APQ8053, APQ8096AU, APQ8098, MDM9206, MDM9207C, MDM9607, MDM9640, MDM9650, MSM8905, MSM8909W, MSM8996, MSM8996AU, QCN7605, QCN7606, QCS605, SC8180X, SDA660, SDA845, SDM439, SDM630, SDM636, SDM660, SDM670, SDM710, SDM845, SDX20, SDX24, SDX55, SM8150, SXR1130
Affected software
Qualcomm Sda660 Firmware
Qualcomm Qcn7606 Firmware
Qualcomm Mdm9607 Firmware
Qualcomm Sdm660 Firmware
Qualcomm Qcn7605 Firmware
Qualcomm Sdx20 Firmware
Qualcomm Mdm9640 Firmware
Qualcomm Apq8098 Firmware
Qualcomm Apq8053 Firmware
Qualcomm Mdm9207c Firmware
Qualcomm Apq8096au Firmware
Qualcomm Mdm9206 Firmware
Qualcomm Qcs605 Firmware
Qualcomm Sdm636 Firmware
Qualcomm Sc8180x Firmware
Qualcomm Apq8009 Firmware
Qualcomm Sdx55 Firmware
Qualcomm Msm8909w Firmware
Qualcomm Sdm630 Firmware
Qualcomm Sdm439 Firmware
Qualcomm Sdm845 Firmware
Qualcomm Sm8150 Firmware
Qualcomm Sxr1130 Firmware
Qualcomm Sdm710 Firmware
Qualcomm Sdx24 Firmware
Qualcomm Msm8905 Firmware
Qualcomm Msm8996 Firmware
Qualcomm Msm8996au Firmware
Qualcomm Sdm670 Firmware
Qualcomm Sda845 Firmware
Qualcomm Mdm9650 Firmware